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- 13.05.2019 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction
- 01.12.2016 Industrie 4.0: Deutsch-Chinesische Zusammenarbeit nimmt Fahrt auf
- 15.11.2016 Deutsch-chinesisches Seminar in Chengdu
Links
- BAM - Bundesanstalt für Materialforschung und -prüfung
- DIN Media - DIN Media GmbH
- BMWK - Bundesministerium für Wirtschaft und Klimschutz
- DIN - Deutsches Institut für Normung
- PTB - Physikalisch-Technische Bundesanstalt
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DIN EN IEC 61189-2-501
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022); German version EN IEC 61189-2-501:2022
DIN EN 61189-1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997 + A1:2001); German version EN 61189-1:1997 + A1:2001
DIN EN 61183
Electroacoustics - Random-incidence and diffuse-field calibration of sound level meters (IEC 61183:1994); German version EN 61183:1994
DIN EN 61184
Bajonett-Lampenfassungen (IEC 61184:2017 + AMD1:2019); Deutsche Fassung EN 61184:2017 + A1:2022
Bayonet lampholders (IEC 61184:2017 + AMD1:2019); German version EN 61184:2017 + A1:2022
DIN EN 61184/A2
Bajonett-Lampenfassungen (IEC 61184:2017/AMD2:2024); Deutsche Fassung EN 61184:2017/A2:2024
Bayonet lampholders (IEC 61184:2017/AMD2:2024); German version EN 61184:2017/A2:2024
DIN EN 61188-7
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017
DIN EN IEC 61188-6-4
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019
DIN EN IEC 61188-6-3
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 61188-6-3:2024); German version EN IEC 61188-6-3:2025
DIN EN IEC 61188-6-2
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021
DIN EN IEC 61188-6-1
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021





