News
- 13.05.2019 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction
- 01.12.2016 Industrie 4.0: Deutsch-Chinesische Zusammenarbeit nimmt Fahrt auf
- 15.11.2016 Deutsch-chinesisches Seminar in Chengdu
Links
- BAM - Bundesanstalt für Materialforschung und -prüfung
- DIN Media - DIN Media GmbH
- BMWK - Bundesministerium für Wirtschaft und Klimschutz
- DIN - Deutsches Institut für Normung
- PTB - Physikalisch-Technische Bundesanstalt
Suche
DIN EN 61249-8-8
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings; Section 8: Temporary polymer coatings (IEC 61249-8-8:1997); German version EN 61249-8-8:1997
DIN EN IEC 61249-6-3
Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (IEC 61249-6-3:2023); German version EN IEC 61249-6-3:2023
DIN EN 61249-8-7
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings; section 7: Marking legend inks (IEC 61249-8-7:1996); German version EN 61249-8-7:1996
DIN EN 61249-5-4
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings; section 4: Conductive inks (IEC 61249-5-4:1996); German version EN 61249-5-4:1996
DIN EN 61249-5-1
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings; section 1: Copper foils (for the manufacturer of copper-clad base materials) (IEC 61249-5-1:1995); German version EN 61249-5-1:1996
DIN EN 61249-4-19
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-19:2013); German version EN 61249-4-19:2013
DIN EN 61249-4-18
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-18:2013); German version EN 61249-4-18:2013
DIN EN 61249-3-5
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); transfer adhesive films (IEC 61249-3-5:1999); German version EN 61249-3-5:1999
DIN EN 61249-4-17
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-17:2009); German version EN 61249-4-17:2009
DIN EN 61249-4-16
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-16:2009); German version EN 61249-4-16:2009





