News
- 13.05.2019 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction
- 01.12.2016 Industrie 4.0: Deutsch-Chinesische Zusammenarbeit nimmt Fahrt auf
- 15.11.2016 Deutsch-chinesisches Seminar in Chengdu
Links
- BAM - Bundesanstalt für Materialforschung und -prüfung
- DIN Media - DIN Media GmbH
- BMWK - Bundesministerium für Wirtschaft und Klimschutz
- DIN - Deutsches Institut für Normung
- PTB - Physikalisch-Technische Bundesanstalt
Suche
GB/T 19356-2003
Thermal spraying--Powders--Composition and technical supply conditions
GB/T 17178.2-2010
信息技术 开放系统互连 一致性测试方法和框架 第2部分:抽象测试套规范
Information technology - Open systems interconnection - Conformance testing methodology and framework - Part2: Abstract test suite specification
GB/T 15651.3-2003
半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法
Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods
GB/T 17574.10-2003
半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
GB/T 19403.1-2003
半导体器件 集成电路 第11部分:第1篇:半导体集成电路 内部目检 （不包括混合电路）
Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)
GB/T 19247.3-2003
Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies
GB/T 19247.4-2003
Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies
GB/T 18794.7-2003
信息技术 开放系统互连 开放系统安全框架 第7部分:安全审计和报警框架
Information technology--Open Systems Interconnection--Security frameworks for open systems--Part 7:Security audit and alarms framework