News
- 13.05.2019 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction
- 01.12.2016 Industrie 4.0: Deutsch-Chinesische Zusammenarbeit nimmt Fahrt auf
- 15.11.2016 Deutsch-chinesisches Seminar in Chengdu
Links
- BAM - Bundesanstalt für Materialforschung und -prüfung
- DIN Media - DIN Media GmbH
- BMWK - Bundesministerium für Wirtschaft und Klimschutz
- DIN - Deutsches Institut für Normung
- PTB - Physikalisch-Technische Bundesanstalt
Suche
DIN EN 61191-6
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010); German version EN 61191-6:2010
DIN EN 61193-1
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies (IEC 61193-1:2001); German version EN 61193-1:2002
DIN EN 61196-3-2
Radio frequency cables - Part 3-2: Coaxial cables for digital communication in horizontal floor wiring; detail specification for coaxial cables with solid dielectric for local area networks of 185 m reach and up to 10 Mb/s (IEC 61196-3-2:1997); German version EN 61196-3-2:1997
DIN EN 61196-3
Radio frequency cables - Part 3: Sectional specification for coaxial cables for local area networks (IEC 61196-3:1998); German version EN 61196-3:1998
DIN EN 61193-3
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (IEC 61193-3:2013); German version EN 61193-3:2013
DIN EN 61195
Double-capped fluorescent lamps - Safety specifications (IEC 61195:1999 + A1:2012 + A2:2014); German version EN 61195:1999 + A1:2013 + A2:2015
DIN EN 61193-2
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007); German version EN 61193-2:2007
DIN EN 61190-1-2
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014
DIN EN 61191-2 Berichtigung 1
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017/COR1:2019); German version EN 61191-2:2017/AC:2019
DIN EN 61191-2
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017





